Download Advanced Microsystems for Automotive Applications Yearbook by R. H. Grace (auth.), Sven Krueger, Wolfgang Gessner (eds.) PDF

By R. H. Grace (auth.), Sven Krueger, Wolfgang Gessner (eds.)

Microsystems are a tremendous luck consider the auto undefined. that allows you to fulfil the shoppers requests for safeguard comfort and car financial system, and to fulfill environmental standards, microsystems have gotten critical. hence a lot of microsystem functions got here into the dialogue. With the foreign convention AMAA 2002, VDI/VDE-IT presents a platform for the dialogue of all MST correct elements for automobile functions. The convention court cases assemble the papers through authors from motor vehicle providers and manufacturers.

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Most of the implemented control concepts are rather complex and involve a number of sensor signals to handle. As an example the block diagram of an engine control unit (ECU) is shown in Fig. 1. A typical ECU provides several interfaces to sensors: S. Krueger et al. 3 Signal Processing for Automotive Applications 41 analog input digital input (on/off) pulse width modulated (PWM) input CAN interface In order to protect the electronics from overvoltage all sensor signals have to pass input protection circuits (passive: R, RC circuits; active: specific semiconductors) and filters.

Fine mechanics and microelectronics were both approaching each other, in order to merge into a new generation of miniaturized micro systems consisting of sensing, processing and actuation components. Europe (MST), the USA (MEMS-MicroElectroMechanicaISystems) and Japan (MicroMachines) are the key drivers in the development and market introduction of MST products. Basically, the general concept is to use new materials, mostly well suited for low cost mass production purposes and machining technologies, to form three basic building blocks of every micro system: Sensing / actuation element Package Signal Processing S.

The modular architecture of such systems offers cost reduction (fewer components, batch production), reduction of volume and weight, new functionality (self test, accuracy test), and higher reliability (fewer plugs and cables, fewer components). Examples of this kind of developments are engine management, transmission control, emission control, or ASS systems. Direct mounting of electronics to the aggregates means, that the electronic components have to withstand high ambient temperatures and rapid temperature cycles between -40°C and a maximum temperature, which in several cases exceeds the mil-specified limit of 125°C.

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